IEEE

Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model

Abstract: As the need for processing large amounts of data increases, power consumption and the complexity of semiconductor package patterns also rise, making thermal management crucial. Traditional ...
IEEE

Attention Integrated Residue CNN for Classification of DNA-Binding and RNA-Binding Proteins

Abstract: The classification of DNA-binding proteins (DBPs) and RNA-binding proteins (RBPs) is essential for understanding molecular interactions and regulatory functions. However, the existing ...